Solder and Braze Preforms come in a variety of standard shapes e.g., rectangles, squares, discs or frames, and sizes as required by customers. COINING can customize preform geometry for any application. Dimensions can also be held to tight tolerances for volume accuracy.
Alloys chosen for an application are based on physical properties and strength. A key consideration is the soldering temperature and the operating temperature of the component being soldered. One common rule is to select an alloy that has a melting point at least 50°C higher than that of the operating temperature of the part being joined.
Advantages
- Available in a variety of shapes and sizes
- Increased efficiency and productivity
- Delivers the precise solder to the right location
- More stable quality alternative compared with hand soldering
- Extremely durable
- Solution to solder-starved conditions
Sizing
Rectangle and Disc
Thickness: 0.0005 to 0.030 (+/-) 0.0001 inches (Extremely low sizing) to 0.030 to 0.125 (+/-) 0.001 inches ( Extremely high sizing)
Washer and Frame
Thickness: 0.001 to 0.030 (+/-) 0.0005 inches (Extremely low sizing) to 0.030 to 0.125 (+/-) 0.001 inches ( Extremely high sizing)
Other specifications available upon request.
Material Specification
COINING works efficiently with alloys of silver, gold, tin, lead, antimony, zinc, indium, copper, molybdenum, iron, nickel, Kovar and tungsten. Special alloys can also be used such as palladium, germanium and platinum. Our metallurgists also work with additives like phosphorus, silicon and gallium if needed.
Customers only need to specify the end material properties, and our metallurgists will find a standard alloy, or design a custom material to meet the application need. COINING’s vast experience with both lead-containing and lead-free solders provides customers with the widest range of options.
Applications
- Aerospace
- Medical devices
- Defense
- Optical Communications
How it’s made
COINING’s Solder Preforms are made of solder alloys and customized into shapes and dimensions specific to an application. Microstamped pieces of foil take the shape that matches solder joints, which optimizes soldering distribution in a precise manner. The size of a Solder Preform is determined by the volume of solder needed.