COINING offers Aluminum ribbon which has excellent electrical characteristics, improved heat dissipation, fewer bonds, and improved throughput and increased reliability over wire. Our SPM-Power-Bond-Ribbon is a high purity and corrosion resistant.
Material Specification
| 99.999% Aluminum |
99.99% Aluminum + Ni |
|
Al -99.998%min;
Ni < 2ppm;
Cu, Mg, Si, Fe < 5ppm;
|
Al –99.99%;
Ni –47-53ppm;
Cu, Mg < 20ppm;
Si, Fe < 10ppm; |
Spooling:
COINING has custom designed spools for SPM-Power-Bond-Ribbon.
Advantages
Our Semiconductor Packaging Materials Power Bond Ribbon eliminates the need for multiple wire bonds. The current required with two, three and even four bonds to the same device can now be attained with properly selected ribbon. Ribbon offers better electrical characteristics such as improved heat dissipation, fewer bonds, and improved throughput and increased reliability over wire. One (1) 40x4 mil ribbon can replace eight (8) 5 mil Al wires.
Applications
- Automotive
- Microelectronic devices
- RF Microwave
- High power applications
Our power bond ribbon eliminates the need for multiple wire bonds.