Skip to content


Below you'll find some of the most common questions people ask about COINING. If your query is on the list below just click on it and you'll be taken to the answer. However if you can't find the information you're looking for, try using our website's search facility at the top right.

COINING manufactures solder preforms, and brazing preforms, including popular gold tin preforms, that are used for joining applications in microelectronics packaging and assembly. COINING also is a leading producer of gold, aluminum, and copper bonding wire as well as jumper chips, bonding pads, tabs, heat sinks, lead frames, solder spheres and cover assemblies for the microelectronics industry. Our small Kovar™, molybdenum, copper, tungsten, and clad stamped parts, often packaged in tape and reel configuration or in waffle packs, are used by many customers throughout the world.

We were founded in 1965 and acquired by AMETEK in May 2011.
We are unique in that we are the largest solder preform manufacturer in the world, as measured by both sales volume and units shipped. COINING has the most extensive library of solder preform dies in the industry, with about 15,000 different tools on the shelf, ready to make your parts. Our customers enjoy exceptionally fast lead-times, reliable on-time deliveries, right-the-first time-and-every-time quality and outstanding customer service on solder preforms and other wire and stamped products, from quotation request until order fulfillment.

We serve 1,000+ customers in more than thirty countries around the world since 1965.

Our products are manufactured in our facility in Montvale, New Jersey USA.  
Our Terms & Conditions of Sale and Terms & Conditions of Purchase can be found here: As part of the purchasing process, all suppliers agree to AMETEK’s Supplier Code of ConductHuman Rights Policy and Environmental Health & Safety Policy.  Additionally all suppliers agree to the Purchasing Terms and Conditions   AMETEK Engineered Materials Coining

ISO 9001:2015 Certificate

  • AEM Sdn Bhd ISO 14001: 2015
  • AEM Sdn Bhd ISO 9001: 2015 GTMS
  • AEM Sdn Bhd ISO 9001: 2015 Bonding Wire
ASEM Sdn Bhd ISO/TS 16949: 2016 

- Non plated Microstampings: 8 weeks

  • Preforms: Braze and Solder: 8 weeks
  • Gold wire and ribbon: 6 weeks
  • Plated Microstampings: 12 weeks
  • Cladded materials: 12 weeks
Our sales staff are highly qualified in their respective markets and can answer any questions you may have about specific materials and products. Our engineering and metallurgy experts are also ready to help solve specific issues and guide you to the right materials that will best fit your needs. However if you can't find the information you're looking for, try using our website's search facility at the top right or get in touch via our Contacts page. 
A solder alloy is an alloy that melts below 450C. However, we offer braze alloys available that can withstand the 600C. Braze alloys are alloys that melt above 450C. 
Yes, it is, but we would need to know what overall thickness range you are interested in. The .010 we have listed is the most common thickness, but we can modify that for you.
Can’t find the answer you’re looking for?

Don’t worry - just type in your question below and we’ll get back to you with an answer as soon as possible