Bond Pads are extremely versatile. Bond Pads allow an interconnection between a circuit board and a discrete electronic device. The Bond Pad is typically connected to the circuit board by soldering and at the top side by a wire attachment.
The overall dimensions of the Bond Pad are specified by the requirements of the application. We offer both plated and clad versions. COINING is very flexible with designs, sizing, and materials requested by the customer.
COINING can create and manufacture a variety of different metallic combinations of Bond Pads specializing in the following:
- Molybdenum double clad Nickel
- Copper plated with Nickel plated with Gold
- Copper clad Aluminum
- Copper-Core Connect™
- Kovar single clad Copper