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Copper Clad aluminum bond pad

Copper Clad Aluminum Bond Pads

COINING’s Copper Clad Aluminum Bond Pads are especially developed for the automotive and power semiconductor industries. It is an intermediary piece to attach a sensing device and a circuit board. The Bond Pad is typically connected at the Copper side to the Power Circuit Board by soldering and at the topside to the Al-wire by ultrasonic wedge bonding.
  • Electrical conductivity
  • Solderable on copper side
  • Wire bondable on the aluminum side
  • High-reliability
  • Cost-effective
  • Wide range of Pb-Free and Pb-containing solder alloys available
Material Specification

Clad Alloy Composition:
Aluminum (AL-1145)
Copper (Cu-CDA102, CDA194) 


Aluminum Clad thickness:
12.5μm (0.0005”) min, for wedge bonding up to 200 μm (0.008”) diameter wire.
125μm (0.005”) max, for Al4N/5N or AlMg heavy wire wedge bonding.

Aluminum Clad thickness

  • Automotive- Internal Combustion Engine 
  • Power Semiconductor
The Copper Clad Aluminum Bond Pads are used for making an electrical connection between the AL-based circuitry on the semiconductor die and the Cu- or Au-based circuitry on the Printed Circuit Board side. This method is mostly used for preventing a direct connection between Al and Au, which could result in loose connections. As time progresses, Au and Al build an intermetallic (purple) plague as well as creating (Kirkendall) voids by diffusion rate differences between the two elements into each other. 
How it’s made
COINING’s Copper Clad Aluminum Bond Pads are made through the cladding process. Once cladded it goes through the stamping process, resulting in the finished product. 

Metal Bond Pads Brochure Download