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Ceramic Coining Cover Assemblies

Ceramic COINING Cover Assemblies

COINING Ceramic Cover Assemblies (CCCAs) are used as a lid to hermetic ceramic package. Ceramic Cover Assemblies offer many advantages for the hermetic sealing of electronic packages. The one-piece, cover-frame construction simplifies assembly and eliminates seal failures caused by misalignment of lid and frame.

COINING’s fully automated Cover Assembly manufacturing process supports both low- and high- volume production requirements. In addition, an advanced and tightly controlled welding method is utilized for the cover-frame attachment process. The combination of automated process and superior weld attachment method ensures consistent, high-quality Cover Assemblies.

Advantages
  • Nonmetallic
  • Nonmagnetic
  • Lightweight compared to metal
  • Durable
  • Corrosion resistant
  • Cost savings because climates process steps/assembly
Material Specifications

Ceramics: Al2O3, AlN, BeO

Plating: Nickel plate per QQ-N-290, 50 – 350 μinches thick. Followed by Gold plate per MIL- G-45204, Type III, Grade A, 50 μinches thick minimum. High-reliability, 4-layer plating is also available.

Preform/Frame
Alloy: Au/Sn, Au/Ge, Sn-based (e.g., SAC 305)

Size Tolerance: Length & Width: ±0.003” Thickness: ±0.0003”


Sizing
Size Tolerance: Length & Width: ± 0.003” Flatness: <0.001” for bases <.500” or ≤0.002”
  • for bases ≥ .500”
  • Thickness: 0.010”
Other shapes and sizes available please contact COINING Engineering
Market applications:
  • Aerospace
  • Defense
  • High performance electronics
How it’s made
Attaching lid to the ceramic package is difficult because they are welded, the lid is welded to the frame. It can be done because of electrical conductivity through the lid and frame, a ceramic lid is non electrically conductive. Therefore, a technique other than resistance welding must be used to form the weld. Instead directed energy is utilized to weld them together. Automated directed energy for high volume for low volume it can be done manually.