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Molybdenum Double Clad Nickel Bond Pads

COINING’s Molybdenum Double Clad Nickel Bond Pads are an intermediary piece to attach to a power diode and a heat sink. We also offer additional layers such as Gold, Solder, and Copper.
Advantages
  • Low thermal expansion to match Silicon die
  • High thermal conductivity 
  • Solderable
  • Corrosion-resistant 
Molybdenum Double Clad Nickel Bond Pads
Material Specification
Molybdenum:  ASTM B361
Nickel:  ASTM B162
Gold:  ASTM B562

Also available:
Solder:  J-STD-006
Copper:  CDA 101/102  
Sizing

Dimensions:  0.050 inches by 0.050 inches minimum up to 0.5 inches by 0.5 inches
Thickness:  0.005 inches up to 0.020 inches overall 

Sizing - Molybdenum Double Clad Nickel Bond Pads

Applications
  • Aerospace
  • Military
  • Space 
How it’s made

COINING’s Molybdenum Double Clad Nickel Bond Pads are made through the cladding process. Once cladded it goes through the stamping process, resulting in the finished product.