COINING’s Molybdenum Double Clad Nickel Bond Pads are an intermediary piece to attach to a power diode and a heat sink. We also offer additional layers such as Gold, Solder, and Copper.
Advantages
- Low thermal expansion to match Silicon die
- High thermal conductivity
- Solderable
- Corrosion-resistant
Material Specification
Molybdenum: ASTM B361
Nickel: ASTM B162
Gold: ASTM B562
Also available:
Solder: J-STD-006
Copper: CDA 101/102
Sizing
Dimensions: 0.050 inches by 0.050 inches minimum up to 0.5 inches by 0.5 inches
Thickness: 0.005 inches up to 0.020 inches overall
Applications
How it’s made
COINING’s Molybdenum Double Clad Nickel Bond Pads are made through the cladding process. Once cladded it goes through the stamping process, resulting in the finished product.