COINING’s Copper-Core Connect™ Bond Pads replace the need for using thick solid Solder Preforms, while improving thermal and electrical conductivity by a factor up to 7x. With the ever-increasing miniaturization of electronics and an increased number of (sub) assembly steps, not all assembly connections can be made on a 2D PCB, heat-sink or ceramic substrate. The Copper-Core Connect™ enables designs for making a final, high-power, wire and ribbon connection with contact spots that otherwise cannot be reached. This avoids additional assembly steps.
Advantages
- Improved thermal management
- Increased reliability
- Exact solder volume allows reduced connection areas
- Increased connection density
- Enables easy accessibility for repair/replacement work of components
- Wide range of Pb-Free and Pb-containing solder alloys available
Material Specification
Wide range of Pb-free and Pb-containing solder alloys available:
Solders:
- Sn60Pb40 (melting range 183-188°C)
- Sn96.5Ag3Cu.5 (melting range 217-218°C)
- Au80Sn20 (melting point: 280°C)
- Pb95Sn5 (melting range: 305-314°C)
- Other solders available upon request
Wire and Ribbon Bonding Applications:
Solders:
- Pb91Sn10 (melting range 275-302C)
- Other solders available upon request
Sizing
For Soldering Applications:
Configuration: Solder 1/Cu; Solder 1/Cu/Solder 2
Overall Thickness: > 0.010 inches typical, for thinner gauges contact COINING engineering
Solder 1 & 2 thickness: 0.001 to 0.003 inches typical
For Wire and Ribbon Bonding Applications:
Configuration: Cu/Al; Solder 2/Cu/Al; Solder 2/Cu/Au
Overall Thickness: > 0.010 inches typical, for thinner gauges contact COINING engineering
Solder 2
Thickness: 0.001 to 0.003 inches typical Al layer thickness 0.001 to 0.002 inches typical
Applications
- Automotive
- RF/ Microwave
- Military
- Photonics
How it’s made
Our Copper Core Connect™ Bond Pads are made by our precise cladding technology. After completing the cladding process, the bond pads go through our stamping process.