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Copper Clad aluminum bond pad

Copper-Core Connect™ Bond Pads

COINING’s Copper-Core Connect™ Bond Pads replaces the need for using thick solid Solder Preforms, while improving thermal and electrical conductivity by a factor up to 7x. With the ever-increasing miniaturization of electronics and an increased number of (sub) assembly steps, not all assembly connections can be made on a 2D PCB, heat-sink or ceramic substrate. The Copper-Core Connect™ enables designs for making a final, high-power, wire and ribbon connection to contact spots that otherwise cannot be reached, or must be made in an earlier assembly step.
Advantages
  • Improved thermal management
  • Increased reliability
  • Exact solder volume allows reduced connection areas
  • Increased connection density
  • Enables easy accessibility for repair/replacement work of components
  • Wide range of Pb-Free and Pb- containing solder alloys available
Material Specification
Wide range of Pb-free and Pb-containing solder alloys available: Solders
  • Sn60Pb40 (melting range 183-188°C)
  • Sn96.5Ag3Cu.5 (melting range 217-218°C)
  • Au80Sn20 (melting point: 280°C)
  • Pb95Sn5 (melting range: 305-314°C)
  • Other solders available upon request

Wire and Ribbon Bonding Applications:
Solders:
  • Pb91Sn10 (melting range 275-302C)
  • Other solders available upon request

Copper Core connect

Sizing for solder applications

Sizing
For Soldering Applications

Configuration:  Solder 1/Cu; Solder 1/Cu/Solder 2
Overall Thickness:  > 0.010 inches typical, for thinner gauges contact COINING engineering
Solder 1 & 2 thickness:  0.001 to 0.003 inches typical

Wire and Ribbon Bonding Applications
Configuration:  Cu/Al; Solder 2/Cu/Al; Solder 2/Cu/Au
Overall Thickness:  > 0.010 inches typical, for thinner gauges contact COINING engineering
Solder 2
Thickness:  0.001 to 0.003 inches typical Al layer thickness 0.001 to 0.002 inches typical

Copper Core connect - Sizing

Applications
  • Automotive
  • RF/ Microwave
  • Military
  • Photonics
How it’s made
Our Copper Core Connect ™ Bond Pads are made by our precise cladding technology. After going through the cladding process, they go through our stamping process