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Optical Communications

Optical Communications for global broadband connectivity are pushing the boundaries of what is possible

Optical Communication Applications Include:
  • Worldwide supplier to industrial, telecommunication and process control industry 
  • Lean manufacturing implementation at all facilities 
  • Temperature testing to 1000°F / 538°C 
  • High current contacts using noble metals 
  • High density contact patterns 
  • Hard wired or mated pair design options
  • Reduced lead times for prototype requirements
  • Comprehensive design and testing capabilities 
  • Total Vertical Integration 
  • Machining capabilities 
  • In-house plating 
  • Manufacturing of both low pressure (TO style) and high pressure (stainless steel and titanium) headers 
  • High reliability, hermetically sealed packages from standard outlines (transistor outline, dual in-line, plug-ins and flatpacks) to extremely sophisticated and complex custom configurations 
  • In-house metal fabrication, stamping, grinding, punching 
  • Component manufacturing including RF terminals, DC pin assemblies and SMA, SMP (GPO) and SSMP (GPPO) connectors 
  • Dedicated brazing, sealing, and integration furnaces 
  • In-house tool and die 
  • Split frame manufacturing capabilities for larger, more complex assemblies
  • COINING is ISO9001:2000 (with AS9100A) Registered by NSF
  • Test and Measurement Equipment (RF Frequency) 
  • Satellites 
  • Optical Networking Components
Our Products and Applications Go Into Hermetic Fiberoptic Packages

Brazing preforms

Braze Preforms
Comes in a variety of standard shapes e.g., rectangles, squares, discs or frames, and sizes as required by customers. Solution to solder-starved conditions.

Solder Preform

Solder Preform
Delivers the precise solder to the right location.

COINING Cover Assemblies

COINING Cover Assemblies Improve on the traditional methods of assembly, alignment, and attaching individual parts by supplying one integrated cover assembly that mates to the IC package.

Metal Microstamping

Metal Microstampings These precision stampings are used primarily to dissipate heat or provide an interface for an electronic circuit or component.

Gold Bonding Wire

Gold Bonding wire
Excellent corrosion resistance, subject to high temperature 
or high humidity environments.