COINING’s Kovar Single Clad Copper Bond Pads are used in high-reliability applications. Within the clad contains two different pieces, and the substrate in the middle. Kovar is the substrate with a thin copper clad layer. The copper (bottom) layer is used to solder to a circuit board. The Kovar layer is used to attach a bond wire, typically stainless-steel or gold wire. Our Kovar Single Clad Copper Bond Pads are the intermediary piece to attach to both the wire and the circuit board.
Advantages
- Solderable on one side
- Laserwire bondable on the other side
- High reliability
- Biocompatible
- Durable
- Environmental resistance
- Visual differentiation between top and bottom
- Ease of automated packaging
- Cost effective
- Flexibly made in different shapes and sizes
Material Specification
Kovar: Mil-I-23011 or ASTM F-15
Copper: CDA 101/102
Sizing:
Dimensions: 0.025 inches by 0.25 inches minimum up to 1 inch by 1 inch square
Thickness: 0.005 inches up to 0.020 inches overall
Applications
- Implantable devices
- RF/ Microwave
- Aerospace
How it’s made
Our Kovar Single Clad Copper Bond Pads are made through the cladding process. after completion of the cladding, the stamping process, resulting in the finished product.