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Kovar Single Clad Copper

Kovar Single Clad Copper Bond Pads

COINING’s Kovar Single Clad Copper Bond Pads are used in high-reliability applications. Within the clad are two different pieces, and the substrate in the middle. Kovar is the substrate with a thin copper clad layer. The copper layer (the bottom layer) is used to solder to a circuit board. The Kovar layer is used to attach a bond wire, typically stainless-steel wire or gold wire. Our Kovar Single Clad Copper Bond Pads are the intermediary piece to attach to both wire and a circuit board.
  • Solderable on one side
  • Laserwire bondable on the other side
  • High reliability
  • Biocompatible
  • Durable
  • Environmental resistance
  • Visual differentiation between top and bottom
  • Ease of automated packaging
  • Cost effective
  • Flexibly made in different shapes and sizes  
Material Specification

Kovar:  Mil-I-23011 or ASTM F-15
Copper:  CDA 101/102


Dimensions:  0.025 inches by 0.25 inches minimum up to 1 inch by 1 inch square
Thickness:  0.005 inches up to 0.020 inches overall

Kovar Single Clad Copper

  • Implantable devices
  • RF/ Microwave
  • Military
  • Aerospace

How it’s made

Our Kovar Single Clad Copper Bond Pads are made through the cladding process. Once cladded, it goes through the stamping process, resulting in the finished product. .