COINING’s Copper plated with Nickel plated with Gold Bond Pads are an intermediary piece between a circuit board and another electronic device.
Advantages
- High electrical conductivity
- High thermal conductivity
- Solderable
- Wire bondable
- Automated packaging
- Cost-effective
- Corrosion-resistant electrical conductivity
Material Specification
Copper: CDA 101/102
Nickel: QQ-N-290
Gold: Mil-G-45204, Type III, Grade A
Sizing
Dimensions: 0.025 inches by 0.025 inches minimum up to 1 inch square
Thickness: 0.005 inches up to 0.020 inches overall
Applications
- Automotive - Internal Combustion Engine
- Military
- RF/Microwave
- Medical
- Aerospace
- Photonics
How it’s made
Our Copper plated with Nickel plated with Gold Bond Pads are made from taking a Copper strip and stamping parts from it. The parts then get plated with Nickel and Gold. Our second method is to take Copper plated strip plated with Nickel and Gold, and then the finished product is stamped from there.