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Solder Wire - Blister free

Solder Wire

COINING produces die-attach wire completely in-house with a uniquely designed, proprietary process that limits wire surface oxidation and prevents the inclusion of particles, blisters, drawing media or other substances. Our blister-free wire ensures a constant wire feed onto the die, creating a clean and consistent puddle for proper die attaching.

High-Pb alloys (≥ 85% Pb) are the preferred material for the fast and low-cost production of power components. The benefits of high Pb alloys include resistance to thermal fatigue, high melting temperature and the absence of building intermetallics with most electronics materials.

Sizes

0.020, inch diameter x 0.030 inch thickness

Available Alloys

Pb95.5Ag2.5Sn2.0
Pb97.5Ag1.5Sn1.0
Pb92.5Ag2.5Sn5.0
Pb90Sn10

Advantages

Coining offers a range of standard die-attach alloys with the ability to co-develop product specific new alloys and has the capability to add if needed dopants to the alloy for controlling the wetting angle on various substrate materials. By controlling the wetting angle and the dimensions of the puddle of molten solder, the occurrence of voids can be largely eliminated.

Applications
  • Semiconductors
  • Power modules
  • Automotive