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Gold Bonding Wire

Gold Bonding Wire

COINING’s gold wire standards are unsurpassed in the industry. We manufacture gold wire in diameters as small as 0.0005 inch (12.5 microns), with highly uniform elongation, tensile strength and dimensional properties. All our high-purity wire products are produced from highly refined, vacuum-processed metals.

Advantages

Wire for automatic bonders is a COINING specialty. Pure gold wire doped with controlled amounts of beryllium and other elements is normally used for ball bonding. This process brings together the two materials that are to be bonded using heat, pressure and ultrasonic energy. The most common approach in thermosonic bonding is to ball-bond to the chip, then stitch-bond to the substrate. Our processing has very tight controls to enhance looping characteristics and eliminate sagging.

Our Gold Bonding Wire provides:

  • Extreme bond reliability
  • Wide processing window
  • Low-impact ball and wedge bonding
  • Superior looping performance
  • High-tensile test performance
  • Excellent corrosion-resistance
  • Ultra-fine pitch

Gold Bonding Wire

Material Specification
Au: 99.99% min;
Be: 3-10ppm;
Impurities: Cu, Ag < 30ppm; Fe, Mg < 20ppm;
Total impurities all elements: <100 ppm max;
Sizing

We offer Gold Bonding Wire in a full range of diameters, suiting the needs for strength and hardness/elongation in your wire application.

Diameters as small as 0.0005 inch (12.5 microns) as same as Gold Bonding Ribbon.

Implantable Devices - Medical

Applications

  • Implantable Devices
  • Medical
  • Automotive