COINING offers Gold (Au) ribbon which is typically utilized in high-frequency microwave/RF and high-power applications. Gold is the preferred choice of bonding material when the contact material is not compatible with Aluminum (Al) or Copper (Cu).
Advantages
- Extreme bond reliability
- Wide processing window
- Low impact ball and wedge bonding
- Superior looping performance
- High tensile test performance
- Excellent corrosion resistance
- Higher fusing current than standard Au bonding wire
Sizes
We offer a full range of ribbon dimensions suiting the needs for strength and hardness/elongation in your application.
Gold Bonding Ribbon has higher fusing current then standard Gold Bonding Wire
Applications
- High- frequency microwave/RF
- High-power applications
- Automotive